Product Name:LaZ - low CTE core & PP material
Application Industry:IC Packing
Contact Window:Jay.Chen
EMAIL:This email address is being protected from spambots. You need JavaScript enabled to view it.
Supplier:Sumitomo Bakelite

Sumitomo Bakelite low CTE material, including core and prepreg, are used to produce low warpage IC substrate.

The developing trends and characteristics of electrical products are thin and light. Sumitomo low CTE materials are capable to provide the best solution for IC substrate, in terms of warpage and reliability testing performance. Now, worldwide IC design houses are starting to use Sumitomo low CTE materials for IC substrate mass production.


substrate material