Product Name:Laminated Substrate
Contact Window:Ivan Chiang
EMAIL:This email address is being protected from spambots. You need JavaScript enabled to view it.
Supplier:ASE Electronics
product desc
ASE Electronics has among the industry's most advanced Laminated Substrate process capability to provide single / double / 4 layer and 6 layers of the IC carrier to comply with electronic / computer peripherals, consumer electronics, wireless communications and networking equipment and other products needs.

Product categories include:
BOC Substrate
Memory Card Substrate
CSP Substrate
SiP / POP Substrate
PBGA Substrate